Source: PR Newswire
Qualcomm Incorporated, a leading developer and innovator of advanced wireless technologies, products and services, today announced that it is sampling the industry's first chipsets for dual-carrier HSPA+ and multi-mode 3G/LTE. The Mobile Data Modem(TM) (MDM(TM)) MDM8220(TM) solution is the first chipset to support Dual-carrier High-Speed Packet Access Plus (DC-HSPA+); and the MDM9200(TM) and the MDM9600(TM) chipsets are the industry's first multi-mode 3G/Long Term Evolution (LTE) solutions. These chipsets demonstrate significant progress toward enabling the mass-market commercial deployment of two next-generation network technologies that bring more advanced data capabilities to mobile devices for new global markets in addition to North America.
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