Source: NTT DOCOMO press release
NTT DOCOMO, INC. announced today that it has successfully developed a trial large-scale-integration (LSI) chip that consumes less than 0.04 W of power yet supports multiple-input multiple-output (MIMO) signal detection and decoding for downlink transmissions at 100 Mbps, the speed required for the forthcoming mobile system known as Super 3G, or Long Term Evolution (LTE), approved by the 3rd Generation Partnership Project (3GPP). Compared with chips currently used in handsets compatible with DOCOMO's High Speed Downlink Packet Access (HSDPA) service, which have a maximum downlink rate of 7.2 Mbps, the new chip will enable downlinks that are more than 10 times as fast.
In September 2007, DOCOMO developed a trial LSI chip that demodulates orthogonal frequency division multiplexing (OFDM) signals and detects MIMO signals transmitted from four antennas at a rate of 200 Mbps, and also consumes no more than 0.1 W of power.
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